Advanced Cleaning and Surface Preparation;Technologies and Markets, 2007 - 2012

Background

Effective cleaning has been pivotal to the evolution of the semiconductor industry over the past 40 years. Improvements in materials for removing contaminants and residues from earlier process steps have led to higher yields and enabled new integration schemes.

In 2007, the market for advanced cleaners and post-etch residue removal products reached $1,400 million. Many companies are competing in this area and the requirement for novel technologies offers opportunities to new entrants. All companies competing in this arena require a greater understanding of the market and technology trends.

This report focuses on analyzing novel materials and technologies in both FEOL and BEOL, including post-CMP and bevel and backside cleans.

Report Contents

1. Executive Summary

2. Methodology and Background

3. Model Drivers

Background
Device type
Generic cleaning operations

4. Cleaning Applications

Front end of line (FEOL) requirements
FEOL photoresist strip
FEOL critical cleans
FEOL backside cleans
BEOL photoresist strip
BEOL critical cleans
BEOL backside cleans
Copper PCMP cleaning
Tungsten PCMP cleaning
Oxide PCMP cleaning
Likely future technology
Key IP issues
POR / BKM analysis
Single wafer vs. batch
Chemical classes
Process variables

5. Tools and Emerging Technologies

Wafer cleaning tool types
Tool types — Batch
Tool types — Single wafer
Tool types — Drying
Tool suppliers
Alternative technologies
Environmental considerations

6. Market Analysis and Forecast

Unit operation forecasts
Regional breakdown
Cleans by device

7. Supplier Assessment

Supplier positioning
Company roadmaps
Strengths and weaknesses
Leading suppliers

8. Business Analysis & Opportunities

Market fundamentals
Single wafer tool market
Advanced cleans roadmap
Supplier opportunities
Interviewee comments

For more information or to order this report, call 617.273.8837 or 973.437.4517 or email us at info@linx-consulting.com