Advanced Thin Films for FEOL & BEOL Applications
Background
The semiconductor industry has relied on CVD and PVD technologies to meet most of the requirements in thin film depositions. Along with these process technologies, many standard materials, such as SiO2, Al and Ti, have been relied on to meet a majority of the industry's needs. However, now the industry is facing change with DRAM using ALD at 90 nm and converting to copper en masse at 45 nm, as well as low-k materials, novel gates, and high-k gate dielectrics are all growing rapidly, as illustrated below:
Advanced Thin Film Processes & Materials, 2006 - 2011 has been developed to help planners and market participants succeed in the fast changing thin films market. Specific areas of focus for this report include ALD, PVD, CVD, SOD and ECD.
Report Contents
1. Executive Summary
• 2006 - 2010 consumption of materials (value and volume) and growth
• Market size and growth rates by deposition technolog
• Regional distribution of PVD, 2006 -2010
• Regional distribution of SiCOH and ECD, 2006 - 2010
• Regional distribution of ALD, 2006 - 2010
2. Methodology and Background
3. Forecast Drivers
- Segmentation by device
- Discuss leading technology developers
- Review ITRS Roadmap
- New requirements and technologies
- Review trends in manufacturing
- Map unit operation mode
4. BEOL Deposition Technology
- Applications reviewed by segments including:
- Low-k dielectrics
- Barrier
- Seeds
- Self aligned caps
- ECD
- Device or layer-based analysis for 90 nm, 65 nm, 45nm
- Analysis of trends for 32nm and above
5. Assessment of FEOL and Interconnect Scenarios
Analysis of the commercial and technical maturity, and assessment of these challenges:
• High-K gate dielectrics
• Metal gates
• Contact strain
• Spacers
• STI
• PMD
6. Market analysis and forecasts, 2006 - 2001
Scenarios for future advanced FEOL and interconnect materials as follows:
PVD – AL & Ti
- PVD – Cu & Ta
- Low-K – SiCOH
- Low-K – SOD
- ECD
- SOD– PMD & STI
- ALD – High-K capacitor
- ALD – High-K gate dielectric
- ALD – Metal gate
- ALD – Spacers
- ALD - Nucleation
7. Forecasts by Device Types
• DRAM
• NAND
• NOR
• Advanced Logic
• Logic
• Analog
• Discrete
8. Supplier & Business Assessment
Leading suppliers of:
- Copper seed
- Tantalum barrier
- SiCOH dielectrics
- SOD
- ECD
- ALD
- Influence of tool suppliers
- Competition in AL
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