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CMP Consumables & Specialty Abrasives Service
The CMP Consumables and Specialty Abrasives Research Service is an industry analysis service that builds on Linx Consulting’s experience in CMP and is designed to help planners and market participants succeed in the CMP market.
The service consists of three reports:
Report I — CMP Markets and Technologies for the 22nm Node
In this report, we survey the CMP material growth in wafer fab processing. We review applications (by device process module and technology node) and suppliers, and conclude with an analysis of business opportunities. This report is now available.
Report II — Specialty Abrasives for CMP
Here we present emerging CMP processes and materials with emphasis on the trends for abrasives. Additionally, we forecast abrasive demand using the Linx Materials Models, assess key suppliers, and analyze potential business opportunities. This report is scheduled for release in June 2010.
Report III — Emerging Applications in CMP: TSV and Thinning
TSV offers the potential to reduce device footprint and increase functionality. In this report, we present the key drivers for TSV and survey the different approaches to the technology. The relevant CMP consumables and major market participants, as well as potential business opportunities are described. This report is scheduled for release later this year.
Maximize your Company's growth in CMP
Bringing together the three areas of the CMP value chain allows us to pool our efforts to offer a more cost effective approach for our clients. Subscribe to all three reports and get special pricing on all three, allowing you to stay on top of a growing market and identify valuable opportunities for your company.
For more information about our CMP Research Service, call 617.273.8837 or 973.437.4517 or email us at info@linx-consulting.com
Service Contents
1. Executive Summary
- Impact of Downturn
- Growth in CMP operations
- Growth in slurries and pads, by application
- Regional distribution of polishes
2. Methodology
- List Of Organizations Interviewed
- Model Schematic
3. Forecast Drivers
- Market Forecast
- Roadmap And Device Assumptions
4. CMP Applications in Wafer Fab
Review of POR, Challenges, consumables, activities of leading fabs for the following
applications to 22nm:
- Bulk copper
- Barrier, including Ta/Ru
- Oxide
- Tungsten
- STI
- Metal gate
- Emerging
5. Tools And Emerging Technologies
- Leading tools
- Tool supplier characterization
- Impact of new technologies
- Tool supplier influence on consumable selection
6. Market Assessment And Forecasts
- Overall market for slurries and pads
- CMP unit operation forecasts:
- By application
- By node
- By device type
7. Supplier Assessment
- Supplier’s Shares
- Supplier Landscape
- Material Supplier Profiles
8. Business Analysis & Opportunities
- Market Summary
- Impact of Memory
- Market Opportunities and Scenarios
Schedule
For more information or to order this report, call 617.273.8837 or 973.437.4517 or email us at info@linx-consulting.com
REPORT II — Specialty Abrasives for CMP
1. Executive Summary
- CMP Slurry demand
- CMP Abrasive demand
- Abrasives forecast by type
- Leading suppliers and buyers
2. Methodology
- List Of Organizations Interviewed
3. Forecast Drivers
4. CMP Applications to 22nm, Slurries & Emerging Technologies
- Silicon wafer polishing,
- Stock
- Final
- Copper bulk, by node
- Copper Barrier, by node
- Tungsten
- Oxide and Polysilicon, including Ceria slurries for oxide polish
- STI, including Impact of FA
- Metal Gate
- Emerging applications
5. Abrasives Demand Forecasts (MT & US$, by node & by application) by abrasives type:
- Colloidal silica
- Intermediate grade colloidal silica
- High purity colloidal silica
- Fumed silica
- High PSD fumed silica
- Ceria
- Alumina
- Polymer/composite
6. Abrasive Supplier & Buyer Assessment
- Key suppliers
- Key supply chain relationships
- Key Buyers
- New entrants/technologies
7. Business Analysis & Opportunities
- Market Summary
- Impact of integration
- Winners and losers
- Market Opportunities and Scenario
Schedule
This report is scheduled for release in late Q2.
For more information, call 617.273.8837 or 973.437.4517 or email us at info@linx-consulting.com
REPORT III — Emerging Applications in CMP—TSV and Thinning
1. Introduction
2. Background
- TSV Drivers and Needs
- Comparison of Approaches
3. Applications
- CMP consumables and processes
4. Business Perspectives and Forecasts
- Conclusions
- Demand Forecasts
- Industry Participants
Schedule
This report is scheduled for release in late Q2.
For more information, call 617.273.8837 or 973.437.4517 or email us at info@linx-consulting.com
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