Cleaning & Surface Preparation: Technologies and Markets, 2007—2012
Effective cleaning has been pivotal to the evolution of the semiconductor industry over the past 40 years. Improvements in materials for removing contaminants and residues from earlier process steps have led to higher yields and enabled new integration schemes.
In 2008, the market for advanced cleaners and post etch residue removal products has reached almost $1,300 million. Many companies are competing in this area and the requirement for novel technologies offer opportunities to new entrants; all require a greater understanding of the market and technology trends.
Unit Operations of Cleaning Steps
Report Contents
1. Executive Summary
2. Methodology and Background
3. Model Drivers
• Background
• Device Types
• Generic Cleaning Operations
4. Cleaning Applications
FEOL
1. Post-etch / implant photoresist strip (including high dose implant)
2. Critical cleans (pre-gate, pre- epi, etc.)
3. Damage-free particle removal• Backside / bevel cleaning
• Other cleaning and surface conditioning applications
BEOL
4. Copper/low-k post-etch/ash photoresist strip
5. Aluminum post-etch/ash photoresist strip
6. Backside / bevel cleaning• Particle removal
Post CMP Cleaning
7. Copper
8. Tungsten
9. Oxide
10. Other CMP stepsProcess Flows
Likely future technology
POR/BKM analysis
• Single wafer vs. batch
• Chemical classes
• Process variables
5. Tools and Emerging Technologies
• Wafer cleaning tool types
• Tool types — batch
• Tool types — single wafer
• Tool types — drying
6. Market Analysis and Forecast
• Unit Operation Forecasts
• Regional breakdown
7. Supplier and Formulations Assessment
• Supplier positions and profiles
• Formulations
• Leading suppliers
For more information or to order this report, call 617.273.8837 or 973.437.4517 or email us at info@linx-consulting.com