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Cleaning & Surface Preparation: Technologies and Markets, 2011—2016

Cleaning & Surface prep

Effective cleaning and surface prep has been pivotal to the evolution of the semiconductor industry over the past 40 years. Improvements in materials for removing contaminants and residues from earlier process steps have led to higher yields and enabled new integration schemes.

Cleaning is the most common operation in IC manufacturing, but the challenges in preparing the wafer surface for the next process step continue to increase as contamination is eliminated, material removal limits reduce, and 3 dimensional fine features become more common.

Cleaning and surface preparation processes and markets are influenced by four key areas:

In Cleaning and Surface Prep Technologies and Markets, Linx evaluates:

Cleaning and Surface Prep Technologies and Markets also offers cleaning chemical market share estimates including leading suppliers of:

Report Contents

1. Executive Summary

2. Methodology and Background

3. Forecast Drivers

4. Technology Evolution

5. Forecasts

6. Supplier Analysis

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