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Advanced Thin Film Process Technologies for FEOL and Interconnect Applications Increase Demand for Advanced Materials

Boston, Mass., May 15, 2013 — The market for advanced precursors is expected to grow 40% to $3B by 2017, according to a new report by Linx Consulting, the premier consultant to the electronic materials industry.

This growth in advanced precursors is driving growth in advanced thin film deposition processes, as outlined in the 4th edition of Linx industry Report, Advanced Thin Film Process Technologies for FEOL and Interconnect Applications.

Thin film deposition growth

Advanced Thin Film Process Technologies for FEOL and Interconnect Applications 2012-2017 forecasts growth in advanced thin film deposition processes:

  • PVD 
  • Electrolytic and electroless plating 
  • Spin on materials 
  • CVD and Epi 
  • FCVD 
  • ALD 
  • MOCVD

In addition to growth rates by deposition technology, the report also includes forecasts for materials consumption 2012-2017, regional distribution of depositions, and applications for both FEOL and BEOL deposition technologies and memory.

Linx Consulting is the leading electronic materials consulting firm, serving the semiconductor, photovoltaics, and electronics industries worldwide. The firm develops unique insights and creates knowledge at the intersection of advanced thin film processing and performance chemicals and materials.