Specialty Abrasives For Chemical Mechanical Planarization, 2005 - 2010

Background

Chemical mechanical planarization (CMP) has been a mainstream process in semiconductor manufacturing since the 250nm node. It was initially developed to improve yield and enhance depth of focus in lithography operations as illustrated below:

In 2005, the global market for CMP slurries was $725 million. Specialty abrasives are a key component of CMP slurries and have enabled this technology to be successful.
As such, many companies are interested in investing in this area and require a greater understanding of the market and technology trends.

In addition, the mix of abrasives will evolve as the industry faces many significant changes that will impact CMP including the continued conversion to 300 mm, copper implementation in DRAM, and the development of ceria-based slurries for front-end and oxide applications. The key to success in this market will be based on understanding the timing and magnitude of market changes and current competitive dynamics and targeting the segments that have the best growth prospects. Specialty Abrasives For Chemical Mechanical Planarization, 2005 – 2010 has been developed to help planners and market participants succeed in the CMP consumables market. It relies on insights from Linx Consulting’s recently published report - Chemical Mechanical Planarization, Technologies and Markets to the 45 nm Node.

Report Contents

1. Executive Summary

• Slurry demand
• Abrasives demand
• Abrasives forecast by type
• Leading suppliers & buyers

2. Methodology and Background

3. CMP Drivers

• Wafer unit growth
• Wafer area growth

4. CMP Applications, Slurries & Emerging Technologies (250nm to 45nm)

Silicon wafer polishing
• Stock
• Final

Copper bulk
• 180 & 130nm
• 90 & 65nm
• 4 nm and beyond

Copper barrier
• 180 & 130nm
• 90 & 65nm
• 45nm and beyond
• Ruthenium

Tungsten
• 180nm
• 130 & 90nm
• 65 & 45nm
• Low selectivity

Oxide & Polysilicon
• 250 & 180nm
• 130nm
• 90, 65 &45nm
• 32nm and beyond

Shallow trench isolation
• 180nm
• 130 & 90nm
• 65 & 45nm
• FA

5. Global Abrasives Demand Analysis and Forecast – 2005 to 2010

• Volume and value
• Stock wafer polishing
• Final polishing
• Colloidal silica
• Intermediate colloidal silica
• High purity colloidal silica
• Composite
• Fumed silica
• High purity fumed silica
• Ceria
• Alumina
• Particle ASP assumptions

6. Abrasive Supplier Assessment

• Supplier roll-up
• Suppliers of fumed silica
• Suppliers of colloidal silicas
• Suppliers of high-purity colloidal silicas
• Suppliers of ceria and alumina
• Key buyers
  • Cabot Micro
  • RHEM CMPT
  • Fujimi
  • Hitachi
  • JSR
  • DA Nano
• Leading suppliers
• New entrants

7. Overall Assessment

• Impact of integration
• Evolution of abrasives mix
• Supply chain criticalities
  
  

For more information or to order this report, call 617.273.8837 or 973.437.4517 or email us at info@linx-consulting.com