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Specialty Abrasives For CMP, 2009 - 2014

This report is the second in a series of three CMP reports included in our CMP Consumables and Specialty Abrasives Research Service. Specialty Abrasives for CMP 2009-2014 reviews the technology and slurries behind prime wafer polishing to develop a complete and insightful picture of the specialty abrasives used in CMP.  Overall, Linx expects the markets for specialty abrasives to grow at about 10% per year over the next five years, with the strongest growth coming from ultra high purity colloidal silica, as shown below:

This report contains 5 year forecasts and analyzes key suppliers and buyers of fumed silica, colloidal silica, high purity silica, ceria, alumina as well a organic particles.

The CMP Consumables and Abrasive Service

Specialty Abrasives for CMP 2009 — 2014 is the second in a series of three reports on the CMP market called the CMP Consumables and Abrasive Service. The first report in the series, CMP Markets and Technologies for the 22nm Node was released in April of 2010 and the third report, Emerging Applications in CMP: TSV and Thinning is scheduled for release in Q3 of 2010. Linx Consulting is offering special pricing for subscribing to all three reports as part of our CMP Consumables and Specialty Abrasives Research Service.

Report Contents

1. Executive Summary

2. Methodology

3. Forecast Drivers

4. CMP Applications to 22nm, Slurries & Emerging Technologies

5. Abrasives Demand Forecasts (MT & US$, by node & by application) by abrasives type:

6. Abrasive Supplier & Buyer Assessment

7. Business Analysis & Opportunities

For more information or to order this report, call 617.273.8837 or 973.437.4517 or email us at info@linx-consulting.com