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Advanced Patterning Materials For Semiconductors: Forecast To Exceed $1.5 Billion In 2007

Boston, Mass., May 14, 2007 – Increased complexity in patterning advanced semiconductors will drive the market for spin-on patterning materials to over $1.5 billion in 2007 and over $2 billion in 2011 according to a recently completed industry analysis report from Linx Consulting.  The report establishes that the global market for advanced patterning materials was $1.4 billion in 2006.

These projections are based on findings from ADVANCED PATTERNING 2006 to 2011, a report issued this month.  The report concludes that while the overall market will grow at 9% per year, older materials like g-line, i-line, and DUV resist will show little or no growth, while 193nm resists and related patterning materials will grow strongly.  There will be a 20% growth in 193nm photoresist demand over the forecast period, with 29% growth in demand of 193 BARCs and TARC demand growing at 55%.  Highest growth is forecast for materials for multilayer patterning applications that facilitate high resolution pattern transfer in dry or immersion exposure systems.

Overall, Linx Consulting sees a shift in the supplier base of positive photoresists to Japan with JSR Micro and TOK achieving a combined share of 47%.  Japanese suppliers commanded 77% share of the $1150 million resist market in 2006.  In the $234 million segment of 193nm resists the leading suppliers are JSR Micro, TOK, ShinEtsu and FujiFilm Electronic Materials, with combined share of 86% of the market in 2006.  The largest US supplier of photoresist is Rohm and Haas Electronic Materials.

In the $248 million ancillary materials segment the strongest suppliers are Brewer Science, RHEM, and AZ Electronic Chemicals, with a combined share of 70% of the market.  The need for functional layers which are not photosensitive is opening opportunities for new spin-on-materials to compete in this segment against more traditional CVD films developed by Applied Materials, Novellus and ASM.

This report is the most comprehensive and up-to-date study of advanced patterning yet published.  Focused on advanced technologies for IC manufacture the report analyzes customer needs, and technology trends, drawing the conclusion that multilayer patterning and multiple exposure schemes will be increasingly important in extending 193nm lithography through 45nm and 32nm half pitch patterning as EUV struggles to achieve the infrastructure reliability needed for manufacturing insertion.  The resulting requirement for improved immersion technology will drive the use of materials such as spin on hard masks, amorphous carbon layers, and silicon containing BARCs.

Linx Consulting is an international consulting firm serving the electronics industry. ADVANCED PATTERNING 2006 TO 2011is the latest in a series of reports designed to assist suppliers of electronic chemicals and materials as well as other value chain participants to better participate in the global electronics industry through the provision of knowledge-based services.