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Advanced Patterning, 2006—2011

Background

Photolithographic patterning is a pivotal process in the manufacture of all ICs, and is vital in delivering the density increases in shrinking the most advanced devices.

Today advanced patterning is facing an uncertain future.  Immersion lithography is being improved and implemented in volume manufacturing, but the path to achieving finer patterns is complex and an interaction between equipment materials and processes is used in transferring designs.

This report studies the technology and materials employed, and includes market forecasts from 2006 to 2011 highlighting emerging trends and critical issues for manufacturers and users of materials and ancillaries for IC patterning.

Advanced Patterning 2006-2011 will be a vital source of strategic, tactical and forecast information for marketers and executive managers for producers and users of these materials.
 

Report Contents

1. Executive Summary

    • Market drivers
    • Scenarios impacting demand
    • 2006 consumption of materials (value and volume)
    • 2011 consumption of materials

2. Methodology and Background

3. Forecast Drivers

    • Segmentation by device
    • Discussion of leading technology developers
    • Review ITRS Roadmap
    • New requirements and technologies
    • Review trends in manufacturing
    • Map unit operation model

4. Patterning Technology Review

    • Device or layer based analysis for 90nm, 65nm, 45nm.  Analysis of trends for 32nm and above

    • Applications reviewed by segment including:

    • Wavelength
    • Single layer resists
    • Multi layer resists
    • Hardmask technologies
    • BARCs
    • TARCs
    • Barrier coats
    • Underlayers
    • Shrink technologies
    • Etch/deposition processes

5. Assessment of Advanced Patterning Scenarios

    Analysis of the commercial and technical maturity, and assessment of the challenges, including:

    • 193 Dry
    • 193 Immersion (NA 1.4 to 1.6)
    • Double Exposure
    • EUV
    • Others

6. Market Analysis and Forecasts

    • Scenarios for future advanced patterning
    • Development of roadmap alternatives
    Unit forecasts by device and exposure type / layer

7. Supplier Assessment

    • Roll-up table of suppliers and shares and total revenues
    • Broken by consumable category, overall revenues, and products
    • Detail on suppliers by node, product, and overall revenues
    • Strengths and weaknesses
    • Key customers/applications
    • Likely future direction
    • Discuss which companies are well positioned in future and provide supporting rationale

8. Overall Assessment

    • Roll-up summary of consumables demand and forecasts
    • Geographic breakdowns
    • Leading future opportunities
    • Impact of new technologies and/or alternatives

 


For more information or to order this report, call 617.273.8837 or 973.437.4517 or email us at info@linx-consulting.com