CMP Consumables & Specialty Abrasives Service

The CMP Consumables and Specialty Abrasives Research Service is a comprehensive analysis of the CMP market designed to help planners and market participants identify growth opportunities in CMP. The service consists of three reports, each covering a different area of the CMP value chain: wafer fab processing, processes and materials, and emerging applications.

Maximize your Company's growth in CMP

Bringing together the three areas of the CMP value chain allows us to pool our efforts to offer a more cost effective approach for our clients. Subscribe to all three reports and get special pricing on all three, allowing you to stay on top of a growing market and identify valuable opportunities for your company.

The CMP Service consists of three reports:

Report I — CMP Markets and Technologies for the 22nm Node
In this report, we survey the CMP material growth in wafer fab processing. We review applications (by device process module and technology node) and suppliers, and conclude with an analysis of business opportunities. This report is now available.

Report II — Specialty Abrasives for CMP
Here we present emerging CMP processes and materials with emphasis on the trends for abrasives. Additionally, we forecast abrasive demand using the Linx Materials Models, assess key suppliers, and analyze potential business opportunities. This report is now available.

Report III — Emerging Applications in CMP: TSV and Thinning
TSV offers the potential to reduce device footprint and increase functionality. In this report, we present the key drivers for TSV and survey the different approaches to the technology. The relevant CMP consumables and major market participants, as well as potential business opportunities are described. This report is scheduled for release in Q3 of 2010.

For more information about our CMP Research Service, call 617.273.8837 or 973.437.4517 or email us at info@linx-consulting.com