CMP Technologies & Markets to the 32nm Node
The number of CMP operations is forecast to maintain strong growth over the forecast period, as illustrated below:
In addition, the industry is facing many significant changes that will impact CMP, including the continued conversion to 300 mm and copper implementation in DRAM and FLASH. The key to success in this market will be based on understanding the timing and magnitude of market changes, evolving competitive dynamics, and in-depth understanding of high growth market segments.
CMP Technologies & Markets To The 32nm Node has been developed to help planners and market participants succeed in the CMP consumables market.
Report Contents
1. Executive Summary
- Growth in CMP operations
- Growth in slurries and pads
- Suppliers
- Regional distribution of polishes
2. Methodology
3. Background and Model Drivers
4. CMP Applications
Aspects covered for each of the following applications:
- Challenges
- Typical POR
- Consumables
- Key IP
- Activities of leading users
- Markets (65 nm and above)
- Bulk copper 65, 45 & 32nm
- ECMP technology
- Copper end point 65, 45 & 32nm
- Copper barrier 65, 45 & 32nm
- Tungsten 65, 45 & 32nm
- STI 65, 45 & 32nm
- Oxide 65, 45 & 32nm
- Emerging applications
5. CMP Tools & Emerging Technolgoies
- Leading tools/platforms
- Tool supplier characterization
- Impact of new technologies
- Consumable selection
6. Market Assessment and Forecasts
- Total consumables market
- Slurries
- Pads
- CMP operation forecasts
- CMP by applications
- CMP by device segment
7. Supplier Assessment
- Leading suppliers
- Slurry suppliers
- Pad suppliers
- Conditioner suppliers
8. Business Analysis and Opportunities
- CMP consumables
- Customer considerations
- Influence of tool producers
- Sustainability of suppliers
- Interviewee comments
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