CMP Technologies & Markets to the 32nm Node

Background

The number of CMP operations is forecast to maintain strong growth over the forecast period, as illustrated below:

In addition, the industry is facing many significant changes that will impact CMP, including the continued conversion to 300 mm and copper implementation in DRAM and FLASH. The key to success in this market will be based on understanding the timing and magnitude of market changes, evolving competitive dynamics, and in-depth understanding of high growth market segments.

CMP Technologies & Markets To The 32nm Node has been developed to help planners and market participants succeed in the CMP consumables market.

Report Contents

1. Executive Summary

Growth in CMP operations
Growth in slurries and pads
Suppliers
Regional distribution of polishes

2. Methodology

3. Background and Model Drivers

4. CMP Applications

Aspects covered for each of the following applications:

Challenges
Typical POR
Consumables
Key IP
Activities of leading users
Markets (65 nm and above)
Bulk copper 65, 45 & 32nm
ECMP technology
Copper end point 65, 45 & 32nm
Copper barrier 65, 45 & 32nm
Tungsten 65, 45 & 32nm
STI 65, 45 & 32nm
Oxide 65, 45 & 32nm
Emerging applications

5. CMP Tools & Emerging Technolgoies

Leading tools/platforms
Tool supplier characterization
Impact of new technologies
Consumable selection

6. Market Assessment and Forecasts

Total consumables market
Slurries
Pads
CMP operation forecasts
CMP by applications
CMP by device segment

7. Supplier Assessment

Leading suppliers
Slurry suppliers
Pad suppliers
Conditioner suppliers

8. Business Analysis and Opportunities

CMP consumables
Customer considerations
Influence of tool producers
Sustainability of suppliers
Interviewee comments

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