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Patterning Material Forecast and Market Share Service

The Patterning Material Forecast and Market Share Service is an annual service that covers covers spin-on patterning materials including photoresists and patterning ancillaries. The service takes an independent view of the spin-on patterning materials market to analyze suppliers' market share and forecast growth of market segments.

Designed for marketers, product managers and executive management, this service helps participants:

Report Schedule and Format

The forecasts are published on January 15 and July 15 each year. All reports will be sent out as editable Excel format files to a designated contact at each client company. Companies participating in the service are requested to give input on their views of market developments for each publication of the forecast.

Patterning Market Forecast

Patterning materials

The Patterning Material Forecast and Market Share Service provides a market forecast of Novolak and chemically-amplified resists for all common wavelengths and immersion lithography. Forecasts on patterning ancillaries such as ARCs, TARCs, top coats, immersion materials, and multi-level patterning materials are provided. All forecasts include a segmentation on regions and major device types.

The forecast section of the report includes a five year forecast
(including the year of publication) broken out as follows:

Materials Forecasted

Regions Forecasted

Devices Forecasted

Market Share Estimates

Each report will include market share estimates for AZEM, Brewer / Nissan, Dongjin, FujiFilm Electronic Materials, Honeywell Electronic Materials, JSR Microelectronics, Dow Electronic Materials, ShinEtsu, Sumitomo, and TOK.

Methodology

Linx maintains a unique global materials demand forecast model for IC manufacturing materials. This model is based on a regularly updated wafer start forecast forecast provided under licence by Semico. Linx develops and maintains representative process maps for the device categories detailed in this report by manufacturing node. Combining these process maps with wafer start forecasts provides us with a detailed understanding of process requirements, allowing us to develop volume forecasts.

As an independant check of these forecasts, key suppliers in each market segment are periodically interviewed to collect input on sales volume and revenue. This information is used to correlate market forecasts, as well as to derive market share estimates.

Regional Estimates

Linx estimates regional wafer start volumes in each device segment, updated with information on IC manufacturer capacity plans and utilization.

Device Estimates

For each device category Linx applies a generic process map that includes common best practice for each product generation of that device technology. Where significant technology differences exists between device architectures at one node, the model segments the materials need on estimates of the proportion of devices using each architecture. An example of this is the different layer counts for DRAM at the 65nm HP used for aluminum interconnect versus damascene copper.

The categorization of devices into the reported segments is shown in the table below:

SIA Reported Category Linx Categories
DRAM DRAM
NAND Flash
NOR
MPU Advanced Logic
DSP
Computing
Communications
PLD
MCU Logic
Oth Micro Logic
Std Cell
Gate Array
SRAM
Analog Discrete and Passive
Optoelectronics
Discrete
Other NV Not covered 
Digital Bipolar Not Covered 

Market Share Estimates

Linx estimates market share by cross-correlating market forecasts with reported revenues from market participants. These estimates are made solely on a revenue basis.

Year EUV enters production
ASIC 2016
DRAM/MRAM 2018
NAND/NOR 2015
MPU 2015

Learn more about Patterning Material Forecast and Market Share Service

To request a quote for this service, fill out the following form and we'll send you details and pricing.

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  • To For more information, call 617-273-8837 or email us at info@linx-consulting.com