Patterning Material Forecast and Market Share Service
The Patterning Material Forecast and Market Share Service is an annual service that covers covers spin-on patterning materials including photoresists and patterning ancillaries. The service takes an independent view of the spin-on patterning materials market to analyze suppliers' market share and forecast growth of market segments.
Designed for marketers, product managers and executive management, this service helps participants:
- Understand their position in the global patterning materials market
- Measure progress
- Plan strategy and tactical initiatives
Report Schedule and Format
The forecasts are published on January 15 and July 15 each year. All reports will be sent out as editable Excel format files to a designated contact at each client company. Companies participating in the service are requested to give input on their views of market developments for each publication of the forecast.
Patterning Market Forecast
The Patterning Material Forecast and Market Share Service provides a market forecast of Novolak and chemically-amplified resists for all common wavelengths and immersion lithography. Forecasts on patterning ancillaries such as ARCs, TARCs, top coats, immersion materials, and multi-level patterning materials are provided. All forecasts include a segmentation on regions and major device types.
The forecast section of the report includes a five year forecast
(including the year of publication) broken out as follows:
- g– and i-line resist
- Positive 248nm resist
- Positive 193nm dry resist
- Positive 193nm Immersion resist
- i-line BARC
- 248nm BARC
- 193nm BARC
- Top Coat / Barrier Layer
- Spin-on-Carbon Layers
- Spin-on-Silicon Layers
- North America
- Advanced Logic
- Discrete and Passive
Market Share Estimates
Each report will include market share estimates for AZEM, Brewer / Nissan, Dongjin, FujiFilm Electronic Materials, Honeywell Electronic Materials, JSR Microelectronics, Dow Electronic Materials, ShinEtsu, Sumitomo, and TOK.
Linx maintains a unique global materials demand forecast model for IC manufacturing materials. This model is based on a regularly updated wafer start forecast forecast provided under licence by Semico. Linx develops and maintains representative process maps for the device categories detailed in this report by manufacturing node. Combining these process maps with wafer start forecasts provides us with a detailed understanding of process requirements, allowing us to develop volume forecasts.
As an independant check of these forecasts, key suppliers in each market segment are periodically interviewed to collect input on sales volume and revenue. This information is used to correlate market forecasts, as well as to derive market share estimates.
Linx estimates regional wafer start volumes in each device segment, updated with information on IC manufacturer capacity plans and utilization.
For each device category Linx applies a generic process map that includes common best practice for each product generation of that device technology. Where significant technology differences exists between device architectures at one node, the model segments the materials need on estimates of the proportion of devices using each architecture. An example of this is the different layer counts for DRAM at the 65nm HP used for aluminum interconnect versus damascene copper.
The categorization of devices into the reported segments is shown in the table below:
|SIA Reported Category||Linx Categories|
|Oth Micro Logic|
|Analog||Discrete and Passive|
|Other NV||Not covered|
|Digital Bipolar||Not Covered|
Market Share Estimates
Linx estimates market share by cross-correlating market forecasts with reported revenues from market participants. These estimates are made solely on a revenue basis.
|Year EUV enters production|
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To For more information, call 617-273-8837 or email us at firstname.lastname@example.org