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Strategic Cost Model — Materials Edition

A Collaborative Development Between Linx Consulting and IC Knowledge

Based on the ITRS, the Strategic Cost Model – Materials Edition projects costs, equipment and materials requirements to 2026 for various device categories.  The model details wafer costs, equipment set details and key consumables for a selected type of fab with a specific wafer start capacity in a given region. 

The Strategic Cost Model – Materials Edition:

1. Device Categories and Process Options:

2. Wafer Cost Outputs

3. Equipment Counts & Outputs

Note:  This is a high level output.  Additional cost and equipment segmentation data is also provided.

4. High Level Consumables Output

5. Detailed Consumables Output

Category

Materials Covered

ALD

Device spacers, DRAM capacitors, Flash 3D, Flash CT, HKMG, PCM

CMP

Slurries and pads for copper, barrier, DSL, HKMG, Oxide, Poly, STI, W

CVD

III-V Channel, capping oxide, Spacers, Ply plugs, DRAM caps, DRAM Gate, High-K Gate, ILD Low-K, Logic Gate, ONO, Pad nitride, Passivation, PMD, STI, Strain, W, NF3, NH3, SiH4, WF6

Litho

BY Wavelength – Rinses, BARCs, Developer, HM, Resist, Pre Wet, Si Arc, SOC, TARC, Top coat

Plating

Copper, CoWP

PVD

Al, TaN, Ta, Cu, TaRu, IrO2, PZT, HKMG, TiN, Ni, W, NiCr

Spin-on

Low-K, PMD, STI

Note: All materials can be adjusted for volume, value, dispense volumes, etc.

Completion

The model was completed in April 2012 and is updated multiple times per year.

Benefits

For more information about this report, call 617-273-8837 or 973-437-4517 or email us at info@linx-consulting.com