Upcoming Reports
- Strategic Cost, Equipment and Materials Model —
This model, done in conjunction with IC Knowledge, utilizes ITRS assumptions for baseline NAND, DRAM and LOGIC device architectures to 2024. It also allows users to configure hypothetic memory or logic fabs of various capacities. For any given fab, the model will calculate tool requirements, investment history and key materials required, including CVD, PVD, ALD, CMP, Litho, spin-on and plating materials.
- Advanced Patterning (4th edition) — This report will review the critical double, triple and quadruple patterning schemes along with the materials sets the industry will rely on until EUV is ready. It will also forecast key materials and evaluate the positions of leading suppliers.
- Materials and Processes for Advanced Gate Architectures — FinFETS and FDSOI
- Semiconductor Wafer Fab Materials for TSV Fabrication
- Advanced Thin Films for FEOL and BEOL Applications (4th edition)
- Emerging Memory Devices — This report will review and handicap emerging memory devices and discuss timing to commercialization. It will then examine key memory cell structures and review materials sets and wafer fab processes associated in the cell construction.
- Advanced Cleaning and Surface Preparation (4th edition)
- Chemicals and Materials for Solar Cells and Modules (5th edition)
- PV Module Teardown Analysis – This report will take leading modules and provide an analysis of the key components and materials used to manufacture the modules.
For more information or to order an upcoming report, call 617.273.8837 or 973.437.4517 or email us at info@linx-consulting.com.