2022 Surface Preparation and Cleaning Conference
Monday, October 17, 2022
| 7:30 AM | Breakfast | ||
| 8:45 AM | Introductions, Day 1 Welcome. Conference Overview | Mark Thirsk Joel Barnett |
Linx Consulting Tokyo Electron |
| 9:05 AM | Keynote: Searching for Sustainability in the AI microelectronics Industry | Dean Freeman | FTMA |
| 9:45 AM | Invited: Particle Pecursors - a Nonobvious Source of Defectivity | Gary Van Schooneveld | CT Associates |
| 10:10 AM | Correlation Between Aerosolization Based Metrology and Enhanced Surface Scanning | Derek Oberreit | Kanomax FMT |
| 10:30 AM | Break | ||
| 10:55 AM | Wet Process Challenges with 3D NAND Scaling | Erica Ng | Micron |
| 11:20 AM | Diffusing Chemistry into High Aspect Ratio Microstructures via Vacuum Technology | Ismail Kashkoush | Akrion |
| 11:40 AM | Development of Wet Etchant for Filling Material Removal to Enable 3D NAND Process | Aiping Wu | EMD Electronics |
| 12:00 PM | A Novel Selective Adsorption Polymer to Silicon Nitride Enables Etching Selectivity Control in HF and BHF Etching | Kenji Mochida | Daicel |
| 12:20 PM | Lunch | ||
| 1:30 PM | Keynote: Challenges in Defectivity, Detection and Analytical Metrology | Archita Sengupta | Intel Corporation |
| 2:10 PM | Invited: Wafer Analysis for Contamination | Victor Chia | Air Liquide |
| 2:35 PM | Nanolift Particle Removal Process – Polymer Film Structure Study and Film Queuing Influence on Removal | Thomas Mercadier | STM |
| 2:55 PM | Characterization of Impurities from Incoming PVA Brush for Sub 10 nm Post CMP Cleaning Process | Kwang-Min Han | Hanyang University |
| 3:15 PM | Ti Ion Contamination and Removal Mechanism During the W CMP Process | Palwasha Jalalzai | Hanyang University |
| 3:35 PM | Break | ||
| 4:00 PM | Invited: Water and Other Chemicals: Environmental Concerns for Semiconductor Processing | Julia Goldstein | JLFG Communications |
| 4:25 PM | Sustainable, Highly-efficient Water-based and NMP-free Through Silicon Vias Cleaning for Quantum Computer Interconnects Integration | Alexander Breul | Intelligent Fluids |
| 4:45 PM | Sustainable Wet Photoresist Removal for Compound Semiconductor Fabrication with Improved Manufacturability | Pradeep Waduge | Macom |
| 5:05 PM | Hydroxylamine Free Formulation Development for Post Etch Residue Cleaning | Laisheng Sun | EMD Electronics |
| 5:25 PM | Wrap Up/Additional Questions/Adjourn | Organizers | |
| 6:00 PM | Networking Reception / Poster Session | Mark Thirsk Joel Barnett |
Linx Consulting Tokyo Electron |
Tuesday, October 18, 2022
| 7:30 AM | Breakfast | ||
| 9:15 AM | Day 2 Welcome | Organizers | |
| 9:30 AM | Keynote: The Sustainability Challenge: Wet Etching and Surface Cleaning for Device Z-scaling | Ian Brown | SCREEN |
| 10:00 AM | SiGe Selective Etch for the Formation of Dielectric Isolations in Monolithic CFET | Pallavi Puttarame Gowda | Imec |
| 10:20 AM | Selective Wet Chemical Etching of Si1-xGex in HNO3: HF: H2O | Henan Zhang | Tokyo Electron |
| 10:40 AM | Highly Selective Dry Etching Process for the Removal of SiGe Layers for the Enablement of Stacked Nanosheet Gate-All-Around Transistor Architectures | Ivo Otto | Tokyo Electron |
| 11:00 AM | Break | ||
| 11:25 AM | Single Wafer Pattern Collapse Evaluations | XiuMei Xu | Imec |
| 11:45 AM | Nanosheet RMG Workfunction Metal Patterning Towards CFET | Kenneth Lai | Imec |
| 12:05 AM | Ru Post Etch Residue Removal by Wet Cleans | Shan Hu | Tokyo Electron |
| 12:25 PM | Lunch | ||
| 2:00 PM | Invited: Wet Cleans and Surface Preparation for Augmented Reality (AR) Device Fabrication: Challenges and Novel Technology Developments | Dennis Oriero | META |
| 2:25 PM | Silicon Etching utilizing Near-Infrared and H2 Mitigation in MEMS Applications | Ismail Kashkoush | Akrion |
| 2:45 PM | Through Silicon Vias Cleaning for Quantum Computer Interconnects Integration | Harold Le Tulzo | Technic |
| 3:05 PM | Break | ||
| 3:30 PM | Characterization of Silicon Anisotropic Wet Etching, via Ammonium Hydroxide (NH4OH) Aqueous Solution, Selectively to SiO2 | Emilie Prevost | ST Micro Electronics |
| 3:50 PM | Extreme Silicon Thinning For Back Side Power Delivery Network Application: Need For a Highly Selective Alkaline Silicon Etch Stopping On SiGe Etch Stop Layer | Farid Sebaai | Imec |
| 4:10 PM | Development of UV-assisted Electrochemical Etching | Rintaro Higuchi | Tokyo Electron |
| 4:30 PM | Atomic Layer Etching and Cleaning of Al2O3 from Gold Substrates Measured Using in situ Auger Electron Spectroscopy | Andrew S Cavanagh | University of Colorado |
| 4:50 PM | Wrap Up/Additional Questions/Adjourn | Organizers | |
Posters
| 1 | Poster: Glass Wafer Backside Opaque Layer Removal on 300mm Fabrication Tool for Advanced Packaging | Kenneth Lai | Imec |
| 2 | Poster: Sustainable Reclaim Mode Solutions for TiN Hardmask Etching and Post Etch Residue Removal in advanced BEoL | Andreas Klipp | BASF |
| 3 | Poster: Surface Nanoparticle Monitoring for Plasma Etching Chamber Components using Single Particle- Inductively Coupled Plasma – Mass Spectrometry (SP- ICP-MS) | Lisa Mey-Ami | Airliquide |
| 4 | Poster: New Paradigm for Filtration of sub-10nm Particles in Wet-Etch-and-Clean Chemicals | Wilson WS Poon | WL Gore |
| 5 | Poster: Advanced Filtration Products with Higher Flow and Faster Start-Up Time for Next-Generation Semiconductor Processing Technologies | Varun Vakharia | Pall |
| 6 | Poster: Case Study of Huntsman Quaternary Ammonium Hydroxide (QAH) Performance for Semiconductor Applications | Victoria White | Hunstman |
| 7 | Poster: Optimization of Dummy Poly-silicon Removal in High-k Metal Gate Process | Sally Ann Henry | ACM Research |
| 8 | Poster: Advanced Solutions for Improved post-CMP Cleaning Applications | Katie Gramigna | Dupont |
| 9 | Poster: Elimination of Surface Particles with Parallel Streak Signature by Optimizing Post CMP Cleans | Jomel Desamito | Global Foundries |
| 10 | Poster: Enhanced post-CMP Cleaning of SiC using Megasonic Activated Chemistries | Mantas Miliauskas | Lewis University |