2024 BIC/SPCC Agenda
BIC
Tuesday, April 23, 2024
Tuesday, April 23, 2024
7:30 AM | Breakfast | ||
9:00 AM | "Conference Welcome Scenario Planning Introduction" | Mark Thirsk - Linx Consulting Duncan Meldrum - Hilltop Economics |
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9:20 AM | Macroeconomic Trends | Stephanie Guichard - The Conference Board | |
10:00 AM | Vote 1 | ||
10:10 AM | Geoplitical Trends | Matt Gertken - SVP BCA Research | |
10:50 AM | Coffee Break | ||
11:20 AM | A view from Taiwan | Andy Tuan - Linx Consulting | |
11:50 AM | Vote 2 | ||
12:00 PM | Technology Trends | Mike Corbett - Linx Consulting | |
12:30 PM | Vote 3 | ||
12:40 PM | LUNCH | ||
2:00 PM | Regional Trends | Mark Thirsk - Linx Consulting | |
2:30 PM | Vote 4 | ||
2:40 PM | Chip Scale Packaging | Mark Berry - COT-NPI Group LLC | |
3:20 PM | BREAK | ||
3:50 PM | OEM Viewpoint | Ian Brown - VP Screen SPE US | |
4:20 PM | IDM Viewpoint | Jeff Hemphill / Archita Senguphta - Intel | |
4:50 PM | Model Summary | Mark Thirsk - Linx Consulting Duncan Meldrum - Hilltop Economics |
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5:30 PM | Conference End | ||
5:30 PM | Happy Hour | Organizers | |
7:00 PM | Day End |
SPCC
Wednesday, April 24, 2024
Wednesday, April 24, 2024
7:30 AM | Breakfast | ||
9:00 AM | Introductions, Day 1 Welcome. Conference Overview | Mark Thirsk Joel Barnett |
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9:20 AM | Keynote: Challenges and Trends of Wet Clean Process in Semiconductor Technologies | Hyosan Lee | |
10:00 AM | Highly Uniform PolySi Channel Etch | Jack Ke | |
10:20 AM | Dummy Poly Gate Etch Clean Challenges in Advanced Nanosheet Devices | M. Sankarapandian | |
10:40 AM | BREAK | ||
11:10 AM | High Selective Wet Etching of different SiGe Layers for CFET Structures with Selectipur E-2504 Solution | Francisco Lopez | |
11:30 AM | Etching of tungsten via a combination of thermal oxide formation and wet chemical oxide dissolution | Antoine Pacco | |
11:50 AM | Molybdenum Wet Etchant with Dual Dissolver System for 3D NAND Fabrication | Chia-Wei Wang | |
12:10 PM | PN boundary scaling by suppression of lateral etching of WF metal | Dai Ueda | |
12:30 PM | LUNCH | ||
2:00 PM | Keynote Intel: Contamination Monitoring on Photomask Substrates with TXRF | Sergey Mezhenny | |
2:40 PM | Plasma-based Dry Clean Process Monitoring by Exhaust Gas Analysis with ToF-MS | Minhyoung Kim | |
3:00 PM | A Study on the Causes of Carbonly Sulfide Residue by Etching and Cleaning Process Interaction | Youngeun Kim | |
3:20 PM | BREAK | ||
3:50 PM | Changes in Surface Chemical Characteristics of 4H-SiC for Better Cleaning Performance | Yoon-Ji Ra | |
4:10 PM | Is ultrahigh vacuum technology potential approach to prepare industrial Si surfaces? | Elmira Jahanshahrad | |
4:30 PM | Performance characterization of surface enhanced particle sizing for reliable detection of sub-10nm particles on 300mm wafer | Ali Ö. Altun | |
4:50 PM | Insights into Water Affinity of Non-Volatile Residue Particles Generated from Aerosolized Ultrapure Process Chemicals | Derek Oberreit | |
5:10 PM | Wrap Up/Additional Questions/Adjourn | ||
5:30 PM | Networking Reception/Poster Session | Organizers | |
7:30 PM | Day 1 End |
Thursday, April 25, 2024
7:30 AM | Breakfast | ||
9:15 AM | Day 2 Welcome | David Maloney | |
9:15 AM | Keynote | Jin-Goo Park | |
9:50 AM | Extreme Silicon Thinning For Back Side Power Delivery Network Application Si Thinning Stopping on Scaled SiGe Etch Stop Layer | Farid Sebaai | |
10:10 AM | Backside metallic contamination removal focused on noble metals using an halogen-based solution | Marie-Claire Pignié | |
10:30 AM | BREAK | ||
10:55 AM | Superiority of Bevel Nozzle Dispense Spin over Backside Center Dispense Spin for Wafer Bevel Cleaning Insights from Computational Fluid Dynamics | Rencheng Dong | |
11:15 AM | Investigation of the water scatter in single cleaning process by deriving a splash parameter | Seunghyeon Baek | |
11:35 AM | Effect of SDS Surfactant in H2 DIW on Cavitation Bubble Dynamics in Ultrasonic and Megasonic Fields | Mir Jalal Khan | |
11:55 AM | The Intersection of Semiconductors and Governments Increased Funding, Support…and Regulations | Kevin J. McLaughlin | |
12:15 PM | LUNCH | ||
1:50 PM | Keynote - Sustainability Opportunities for A Diverse and Secure Fluorinated Material Supply Chain | Christine McGuiness | |
2:25 PM | Real time analysis of ppt levels of organics in UPW | Suhas Ketkar | |
2:45 PM | Quantitation of Potential Critical Organic Contaminants from Polymer Components | Larry Zazzera | |
3:05 PM | Modeling and Simulation of Boron Removal from Water using n-Methylglucamine | Ashutosh Bhabhe | |
3:25 PM | Efficient wet stripping of Photo Resist by UV Flood-Exposure | Amaia Diaz De Zerio | |
3:45 PM | Wrap Up/Additional Questions/Adjourn | Organizers | |
3:55 PM | Day 2 End |
Posters
Development of Sustainable Pyrrolidinone-Based Solvents for Wet Cleaning | Chihhung Ko | Eastman |
Wet Etching Mechanism of Ruthenium Effect of Oxidant | Hwan Park | Sungkyunkwan University |
Study of Quaternary Ammonium Hydroxide (QAH) for Photoresist Applications | Hui Zhou | Huntsman |
Use of Hybrid metrology approach to develop holistic filtration solutions in Hydrogen Peroxide | Kusum Maharjan | Entegris |
Conjointly address stringent device specifications, long bath life considerations, and HSE/ESG standards for specific copper seed wet etching applications | Harold le Tulzo | Technic |
A Copper (Cu) Post-CMP Cleaning Formulation For Both Wafer and Pad Clean | Jacky Cheng | DuPont |
Enhanced Surface Activation through Advanced Hydrogen Peroxide Vapor Delivery | Adrian Alvarez | RASIRC |
Application of TMAH In Semiconductor Wet Etching | Kai Liu | ACM |
Development of a wafer heating stage for thermal desorption spectrometry | Xiaoyu Zou | AirLiquide Balazs |
Hydroxylamine-free Chemistry for Sustainable Alternatives in Aluminum Post Etch Residue Removal Applications | Pei-Sung Hung | DuPont |
Reduced Chemical Consumption and Metal Loss for Polymer Clean by Batch Spray | Bernhard Hammerl | Sicconex |
Hsinfu Teng | Fudan University |