Advanced Thin Films

Advanced Thin Film Processes & Materials for FEOL & Interconnect Applications, 2020 — 2025

The semiconductor industry has relied on CVD and PVD technologies to meet much of the requirements in thin film depositions. Along with these process technologies, many standard materials, such as SiO2, Al and Ti, have been relied on to meet a majority of the industry's needs.

Advanced Thin film Samsung

However, now the industry is facing significant change starting with the conversion to FinFETS as well as novel DRAM structures enabling spacers, novel gates, high-κ gate dielectrics, etc. to all grow rapidly.

These new devices are leading to the adoption of many advanced deposition precursors and processes including ALD, MOCVD, FCVD, Gapfill/SOD, electroplating and others.  This report examines the applications for advanced precursors and forecasts demand to 2025.

Advanced Deposition Precursors

The ninth edition of Advanced Thin Film Processes & Materials for FEOL and Interconnect Applications, 2020—2025 includes:

  • Detailed forecasts by product and application to 2025
  • Detailed overview of the application technology

Report Contents

1. Executive Summary
  • 2020—2025 consumption of materials
  • Growth rates by deposition technology
  • Regional Distribution of Suppliers
2. Methodology and Background
3. Forecast Drivers
  • Segmentation by device type
  • Introduction of EUV
  • Map unit operations by device type
4. Assessment of FEOL Deposition Technology
  • STI/PMD
  • Metal Gates
  • High-κ Gate Dielectrics
  • Beyond FinFet
  • High Mobility Channels
  • Strain
  • Spacers
5. Assessment of BEOL Deposition Technology
  • Review of Applications
    • Copper Barrier
    • Copper Seed & Cobalt SEL
    • ECD Copper & Cobalt
    • Alternative Interconnects
    • FEOL Interconnects
    • Self Aligned Caps
    • Low-κ Dielectrics & ESL
6. Assessment of Memory Devices
    • 2D & 3D NAND
    • MRAM
    • Cross Point/PCM
    • DRAM
7. Material Market Analysis and Forecasts, 2020—2025
  • By application and year in terms of value and volume:
    • ALD
    • CVD
    • ECD
    • PVD
    • SOD
8. Leading Suppliers & Business Assessment
  • Leading suppliers by material
  • Share review by segment
  • Competitive review