CMP Specialty Abrasives

Specialty Abrasives for CMP, 2020

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As the industry changes, the introduction of novel transistor structures such as FinFETs are enabling many new CMP process steps with unique slurry requirements for selectivities, purity levels and defectivity. Traditional CMP steps such as copper and barrier are also changing, in materials planarized as well as process requirements.

These new requirements, along with the trend towards lower abrasives content and emphasis on the chemo component of CMP instead of mechanical aspects, are reshaping the abrasives industry. The fifth edition of this report allows companies to understand the impact of the changes and plan for accordingly.

This report analyzes emerging CMP processes and materials with emphasis on the trends for abrasives. Additionally, we forecast abrasive demand using the Linx Materials Models, access key suppliers, and detail potential business opportunities.

Report Contents

1. Executive Summary
  • CMP Slurry Demand, 2019-2024
  • CMP Abrasive Demand, 2019-2024
  • Abrasives Forecast by Type
  • ASPs
  • Leading Suppliers and Buyers
2. Methodology
  • Abrasives Allocation by Application and Node
3. Forecast Drivers
  • Slurry Market
  • Technology Roadmaps
  • Wafer Market Forecast
  • ITRS
4. CMP Applications to 5 nm, Slurries & Emerging Technologies
  • Copper Bulk
  • Barrier
  • Tungsten
  • Cobalt
  • Oxide and Polysilicon
  • STI and Ceria-based
  • Emerging Applications
  • Silicon Wafer Polishing
5. Abrasives Demand Forecasts 2019-2024 (MT & US$, by node & by application) by Abrasives Type:
  • Colloidal Silica
  • High Purity Colloidal Silica
  • Fumed Silica
  • Ceria
  • Alumina
6. Abrasive Supplier & Buyer Assessment
  • Key Suppliers
  • Key Supply Chain Relationships
  • Key Buyers
  • New Entrants/Technologies
7. Business Analysis & Opportunities
  • Market Summary
  • Abrasives by Application
  • Industry Concentration
  • Quality Requirements
  • Conclusions