The Surface Preparation and Cleaning Conference (SPCC)

The Surface Preparation and Cleaning Conference

semiconductor wafer
The Surface Preparation and Cleaning Conference (SPCC) is the world’s largest conference dedicated to cleaning and preparation.

SPCC offers a unique opportunity for IC manufacturers, equipment makers, chemical and material suppliers, metrology and process monitoring suppliers, and researchers to hear presentations on cutting edge research cleaning technologies for the electronics industry. The scope of the conference encompasses front-end, back-end, equipment, materials, metrology, and equipment developments and issues in wafer cleaning.

The conference is comprised of invited presentations, reviewed technical oral presentations and posters covering all aspects of cleaning. Invited expert speakers will review key aspects of the surface preparation and cleaning markets.

Network with Industry Experts

Technologists, academics, product managers, and marketing managers focused on solving problems in semiconductor cleaning technology will benefit from the Surface Preparation and Cleaning Conference.

Reminder to register for conference before March 3, 2019 to take advantage of hotel room block rate.

Still time to be a sponsor of the conferences! Contact Audrey Parton for more info.

AGENDA – Conferences 2019
Monday 01-April, 2019 - Location: Design & Fashion
7:30 AM Business of Cleans Registration
7:30 AM Breakfast
8:45 AM Introductions, Welcome, Conference Overview Organizers
9:00 AM Economy & Market Dr. Duncan Meldrum Hilltop Economics
9:30 AM Economy & Market Mike Corbett Linx Consulting
10:00 AM Technology Trends Kathleen Fiehrer Intel
10:30 AM Break
11:00 AM Technology Trends Nabil Mistkawi Samsung
11:30 AM OEM Point of View Katerina Mikhaylichenko Applied Materials
12:00 PM Lunch
1:30 PM Contamination control TBA PALL
2:00 PM Key Materials Kevin McLaughlin Sachem
2:30 PM Key Materials Tianniu Rick Chen Versum Materials
3:00 PM Key Materials Mike White Entegris
3:30 PM Break
4:00 PM Structured Networking
4:30 PM Technology Trends Kevin Ryan GLOBALFOUNDIRES
5:00 PM Business of Cleans Conference Ends
2:00-5:00 PM SPCC Pre-Registration
5:30-7:30 PM Network Reception - Yard House, 888 SW 5th Ave
Tuesday 02-April, 2019 - Location: Design & Fashion
7:30 AM Breakfast
7:30 AM - on SPCC Registration
9:00 AM Introductions,  Day 1 Welcome, Conference Overview Mark Thirsk Joel Barnett
9:20 AM Invited: Intel Ravi Pillarisetty Intel
9:55 AM Cobalt pre-metallization clean and functional water rinse in BEOL interconnect Els Kesters imec
10:15 AM Functional water solutions to enable wet cleaning process Hideaki Iino Kurita
10:35 AM Break
11:00 AM Controlled cobalt recess for advanced interconnect metallization Antoine Pacco imec
11:20 AM Development of Metal Free Wet Etching Chemical for Ruthenium Interconnect Takuya Ohashi TOK
11:40 AM Wet etching of Ruthenium: effect of thermal annealing Quoc Toan Le imec
12:00 PM Interfacial Layer (IL) Engineering to Extend Scalability of High-k Metal Gate for Si CMOS Devices Shariq Siddiqui GLOBALFOUNDRIES
12:20 PM Lunch
1:45 PM Invited: Cleaning Challenges associated with Scaling Boosters and New Device Architectures Yusuke Oniki imec
2:10 PM Development of Selective SiGe Etchants Glenn Westwood Avantor
2:30 PM Thermal Atomic Layer Etching of Silicon Using an Oxidation and “Conversion-Etch” Mechanism Steve George University of Colorado
2:50 PM Si trim applications: benefits and challenges Subhadeep Kal Tokyo Electron
3:10 PM Break
3:30 PM Phenomena affecting the rate and equilibrium of aqueous chemical reactions in nanochannels Guy Vereecke imec
3:50 PM Improving cleaning for advanced packaging Simon Braun imec
4:10 PM Effect of bubble on particle agglomeration in W CMP slurry Jin-Goo Park Hanyang University
4:30 PM Optimization of the removal of wafer backside ESC defects arising from ion implantation by scrubber processing with acidic chemical David Kirkwood Axcelis
4:50 PM Pause
5:00 PM Panel Discussion Moderator: Mike Corbett Linx Consulting
6:15 PM Wrap Up/Additional Questions/Adjourn Organizers
6:15 PM Networking Reception/Poster Session Mark Thirsk/Joel Barnett
Day 1 SPCC End
Wednesday 03-April, 2019 - Location: Design & Fashion
7:30 AM Breakfast
9:15 AM Day 2 Welcome Organizers
9:30 AM Invited: Litho Jeff Smith Tokyo Electon
10:00 AM Oxide Regrowth Mechanism during Silicon Nitride Etching in Vertical 3D NAND Structure Sangwoo Lim Yonsei Univ
10:20 AM Phosphoric acid rinse impact on CMOS devices Philippe Garnier STM
10:40 AM Hybrid DHF and N2 Jet Spray Cleaning for Silicon Nitride and Metal Layer Kook Hyun An Hanyang University
11:00 AM Break
11:25 AM Invited:  Python based data analysis for Time of Flight Secondary ion mass spectrometer data Sean Stewart Aerospace
11:55 AM Optimization of Single Nanoparticle ICP-MS Analysis for Controlling Nanoparticles in Process Chemicals Lisa Mey-Ami Air Liquide
12:15 PM Universal surface enhanced Raman spectroscopy Ali Altun UNISERS
12:35 PM Lunch
2:00 PM Invited: Duncan Meldrum Hilltop Economics
2:25 PM Particle adsorption model on silicon wafer for clarifying required ultrapure water quality Yoichi Tanaka Kurita
2:45 PM Monitoring and Remediation of Contaminants in Bulk Chemical Eugene Shalyt ECI
3:05 PM New Methods To Reduce Variation In Bare Wafer Particle Inspection Results Harvey Tang Entegris
3:25 PM Contamination Kinetics Of Airborne Ammonia On Chromium-Coated Wafer In Cleanroom Conditions Minh-Phuong Tran CEA-Leti
3:45 PM Wrap Up/Additional Questions/Adjourn Organizers
3:55 PM Day 2 SPCC End
Improvement in post-Chemical Mechanical Planarization cleaning process for Ru interconnects Ken Harada imec
The Effects of Reductant on the Cleaning Performance for Ceria slurries with Post CMP cleaning Areji Takanaka Kanto
Novel method to characterize the retention of polydisperse particles by advanced membranes Suwen Liu Entegris
TiN Hardmask Wet Etching and Post Etch Residue Removal in BEoL Andreas Klipp BASF
Development of Wet-etch Chemistries for Selective Silicon Nitride Removal in 3D NAND Structure Jhih-Kuei Ge Versum
Understanding Interfacial Surface Interactions: Dielectric Wafer – Slurry Particles, Defectivity Improvements and Current Challenges for Low pH W-Post CMP Cleaning Formulations Daniela White Entegris
Post-Etch Residue Removal for Cobalt Contact and Interconnect Wilson Yeh Dupont
Development of Monitoring Technique for High Temperature  Phosphoric Acid by Spectroscopy Yutaro Tsuchisaka Horiba
TiN/High-K Dielectric Selective Etching for Work Function Metal removal with dielectric compatibility Wei-Shao.Tung Dupont
Chemically Controlled Megasonic Cleaning Technology for Higher PRE and Lower Pattern Damage Bongkyun Kang BASF
Study on Wet Etching of Dummy Poly-Si Dongjoo Shin SKKU
Optimization of Water Polishing for an Improved Abrasive Removal Seokjun Hong SKKU
Removal of Nano Particles on the Hard Mask Wafer Backside using Brush Cleaning Hyun-Tae Kim Hanyang Univ
Surface Analysis for EUV Lithography Process Outgassing Studies Xiaoyu Zou Air Liquide
Post-CMP W Cleaners with Excellent Tungsten Residues and Titanium Residues Removal Shih-Hsun Lin Dupont
Elimination of Surface Particles with Lobe Signature by Optimizing Post-Ash Cleans Dhiman Bhattacharyya GLOBALFOUNDRIES
Wet Etchant for DRAM Word line Titanium Nitride Recess with Selectivity to Tungsten Wilson Yeh Dupont
Humidity Control in a FOUP by Laminar Air Curtain (LAC) When FOUP Door is in Open Condition Shih-Cheng Hu NTUT
Characterization of Ultrasonic Cleaning Performance for a Process Wafer Carrier Petrie Yam Onda
Investigation of Ceria Abrasive Removal during Post Chemical Mechanical Polishing Cleaning Juhwan Kim SKKU
Aluminum Nitride Removal Formulation with Isotropic Silicon Etching Property Chung-Yi Chang Versum
Material Solution toward Efficient Polysilicon post-CMP Clean Jhih-Fong Lin Dupont
Advances of Oxide PCMP Clean Process: A Total Solution toward Superior Defect Performance Jhih-Fong Lin Dupont
Approach toward enhanced cerium residue control on post-CMP cleaned surface Jhih-Fong Lin Dupont
Linx Cleaning Conferences 2019 Sponsors
Gold Sponsors
Pall CorporationTokyo Electron Limited.
Silver Sponsors
Elemental ScientificAvantor, Inc.Versum MaterialsAsahi/America
Entegris, Inc.SCREEN Semiconductor Solutions Co., Ltd.Advanced Materials Technology, INC.Rippey
Bronze Sponsors
Hilltop EconomicsJSR Micro, Inc.TOKYO OHKA KOGYO CO., LTD.Kurita

Call for Papers

Global semiconductor manufacturers, suppliers, researchers and students are invited to submit abstracts in all aspects of advanced cleaning and surface preparation, including but not limited to those listed below. Technical presentations can include new experimental work and findings or subject area reviews in wet processes and surface preparation.

Submissions addressing current or anticipated (future) challenges are particularly encouraged including:

  • Cleaning challenges associated with advanced memory technologies, including pattern collapse, selective etching, particle removal and surface preparation in DRAM, 3D-NAND, and Emerging Memories.
  • Challenges associated with wet and dry cleaning, surface preparation, and controlled removal of materials associated with advanced Logic structures – including FinFET, Nanosheets and both horizontal, and vertical Nanowire devices.
  • Reduction of environment, safety, health impacts
  • Surface preparation and clean challenges associated with Ge, III-V, and 2D systems.
  • Multi-metal post etch cleans challenges in FEOL and BEOL
  • Post CMP cleaning challenges
  • Copper and low-κ dielectric related cleaning and ashing issues for 3D and advanced interconnect
  • Unique challenges associated with advanced, optical, and EUV mask cleaning, including surface preparation and treatment for resist adhesion enhancement
  • Control of contamination during cleaning, fabrication, exposure, storage, and transport of substrates and masks
  • Challenges associated with providing high purity water and chemicals and the associated delivery systems.
  • Analytical techniques relevant to surface preparation.
  • In-situ monitoring techniques and statistical process control of cleaning or wet processes.
  • The effect of surface preparation on electrical/device performance.
  • Surface finishing in relation to packaging, such as bondpad corrosion.
  • Surface preparation and passivation challenges in photovoltaic, MEMS, and nanoelectronics.
  • Defect/particle reduction techniques for advanced CMOS or automotive devices.

Abstract Submissions

Abstracts in (MS Word or PDF only) should be two-page (maximum) and include the selected topic. Authors are also invited to expand their papers for submission to a special peer reviewed edition of the Microelectronics Engineering issue published after the conference. Only full papers submitted by June 1, 2019 will be considered for publication. When submitting an abstract, please indicate if you also plan to submit a full paper for this publication.

Abstract submissions deadline is December 28, 2018

For questions about the SPCC technical program, please email Joel Barnett.

Abstract Submission Form
  • Accepted file types: pdf, doc, docx, doc, jpg, jpeg, ppx.
    Required file type: pdf,doc,docx,jpg,jpeg,ppx