2024 BIC/SPCC Agenda
BIC
Tuesday, April 23, 2024
Tuesday, April 23, 2024
| 7:30 AM | Breakfast | ||
| 9:00 AM | "Conference Welcome Scenario Planning Introduction" | Mark Thirsk - Linx Consulting Duncan Meldrum - Hilltop Economics |
|
| 9:20 AM | Macroeconomic Trends | Stephanie Guichard - The Conference Board | |
| 10:00 AM | Vote 1 | ||
| 10:10 AM | Geoplitical Trends | Matt Gertken - SVP BCA Research | |
| 10:50 AM | Coffee Break | ||
| 11:20 AM | A view from Taiwan | Andy Tuan - Linx Consulting | |
| 11:50 AM | Vote 2 | ||
| 12:00 PM | Technology Trends | Mike Corbett - Linx Consulting | |
| 12:30 PM | Vote 3 | ||
| 12:40 PM | LUNCH | ||
| 2:00 PM | Regional Trends | Mark Thirsk - Linx Consulting | |
| 2:30 PM | Vote 4 | ||
| 2:40 PM | Chip Scale Packaging | Mark Berry - COT-NPI Group LLC | |
| 3:20 PM | BREAK | ||
| 3:50 PM | OEM Viewpoint | Ian Brown - VP Screen SPE US | |
| 4:20 PM | IDM Viewpoint | Jeff Hemphill / Archita Senguphta - Intel | |
| 4:50 PM | Model Summary | Mark Thirsk - Linx Consulting Duncan Meldrum - Hilltop Economics |
|
| 5:30 PM | Conference End | ||
| 5:30 PM | Happy Hour | Organizers | |
| 7:00 PM | Day End | ||
SPCC
Wednesday, April 24, 2024
Wednesday, April 24, 2024
| 7:30 AM | Breakfast | ||
| 9:00 AM | Introductions, Day 1 Welcome. Conference Overview | Mark Thirsk Joel Barnett |
|
| 9:20 AM | Keynote: Challenges and Trends of Wet Clean Process in Semiconductor Technologies | Hyosan Lee | |
| 10:00 AM | Highly Uniform PolySi Channel Etch | Jack Ke | |
| 10:20 AM | Dummy Poly Gate Etch Clean Challenges in Advanced Nanosheet Devices | M. Sankarapandian | |
| 10:40 AM | BREAK | ||
| 11:10 AM | High Selective Wet Etching of different SiGe Layers for CFET Structures with Selectipur E-2504 Solution | Francisco Lopez | |
| 11:30 AM | Etching of tungsten via a combination of thermal oxide formation and wet chemical oxide dissolution | Antoine Pacco | |
| 11:50 AM | Molybdenum Wet Etchant with Dual Dissolver System for 3D NAND Fabrication | Chia-Wei Wang | |
| 12:10 PM | PN boundary scaling by suppression of lateral etching of WF metal | Dai Ueda | |
| 12:30 PM | LUNCH | ||
| 2:00 PM | Keynote Intel: Contamination Monitoring on Photomask Substrates with TXRF | Sergey Mezhenny | |
| 2:40 PM | Plasma-based Dry Clean Process Monitoring by Exhaust Gas Analysis with ToF-MS | Minhyoung Kim | |
| 3:00 PM | A Study on the Causes of Carbonly Sulfide Residue by Etching and Cleaning Process Interaction | Youngeun Kim | |
| 3:20 PM | BREAK | ||
| 3:50 PM | Changes in Surface Chemical Characteristics of 4H-SiC for Better Cleaning Performance | Yoon-Ji Ra | |
| 4:10 PM | Is ultrahigh vacuum technology potential approach to prepare industrial Si surfaces? | Elmira Jahanshahrad | |
| 4:30 PM | Performance characterization of surface enhanced particle sizing for reliable detection of sub-10nm particles on 300mm wafer | Ali Ö. Altun | |
| 4:50 PM | Insights into Water Affinity of Non-Volatile Residue Particles Generated from Aerosolized Ultrapure Process Chemicals | Derek Oberreit | |
| 5:10 PM | Wrap Up/Additional Questions/Adjourn | ||
| 5:30 PM | Networking Reception/Poster Session | Organizers | |
| 7:30 PM | Day 1 End | ||
Thursday, April 25, 2024
| 7:30 AM | Breakfast | ||
| 9:15 AM | Day 2 Welcome | David Maloney | |
| 9:15 AM | Keynote | Jin-Goo Park | |
| 9:50 AM | Extreme Silicon Thinning For Back Side Power Delivery Network Application Si Thinning Stopping on Scaled SiGe Etch Stop Layer | Farid Sebaai | |
| 10:10 AM | Backside metallic contamination removal focused on noble metals using an halogen-based solution | Marie-Claire Pignié | |
| 10:30 AM | BREAK | ||
| 10:55 AM | Superiority of Bevel Nozzle Dispense Spin over Backside Center Dispense Spin for Wafer Bevel Cleaning Insights from Computational Fluid Dynamics | Rencheng Dong | |
| 11:15 AM | Investigation of the water scatter in single cleaning process by deriving a splash parameter | Seunghyeon Baek | |
| 11:35 AM | Effect of SDS Surfactant in H2 DIW on Cavitation Bubble Dynamics in Ultrasonic and Megasonic Fields | Mir Jalal Khan | |
| 11:55 AM | The Intersection of Semiconductors and Governments Increased Funding, Support…and Regulations | Kevin J. McLaughlin | |
| 12:15 PM | LUNCH | ||
| 1:50 PM | Keynote - Sustainability Opportunities for A Diverse and Secure Fluorinated Material Supply Chain | Christine McGuiness | |
| 2:25 PM | Real time analysis of ppt levels of organics in UPW | Suhas Ketkar | |
| 2:45 PM | Quantitation of Potential Critical Organic Contaminants from Polymer Components | Larry Zazzera | |
| 3:05 PM | Modeling and Simulation of Boron Removal from Water using n-Methylglucamine | Ashutosh Bhabhe | |
| 3:25 PM | Efficient wet stripping of Photo Resist by UV Flood-Exposure | Amaia Diaz De Zerio | |
| 3:45 PM | Wrap Up/Additional Questions/Adjourn | Organizers | |
| 3:55 PM | Day 2 End | ||
Posters
| Development of Sustainable Pyrrolidinone-Based Solvents for Wet Cleaning | Chihhung Ko | Eastman |
| Wet Etching Mechanism of Ruthenium Effect of Oxidant | Hwan Park | Sungkyunkwan University |
| Study of Quaternary Ammonium Hydroxide (QAH) for Photoresist Applications | Hui Zhou | Huntsman |
| Use of Hybrid metrology approach to develop holistic filtration solutions in Hydrogen Peroxide | Kusum Maharjan | Entegris |
| Conjointly address stringent device specifications, long bath life considerations, and HSE/ESG standards for specific copper seed wet etching applications | Harold le Tulzo | Technic |
| A Copper (Cu) Post-CMP Cleaning Formulation For Both Wafer and Pad Clean | Jacky Cheng | DuPont |
| Enhanced Surface Activation through Advanced Hydrogen Peroxide Vapor Delivery | Adrian Alvarez | RASIRC |
| Application of TMAH In Semiconductor Wet Etching | Kai Liu | ACM |
| Development of a wafer heating stage for thermal desorption spectrometry | Xiaoyu Zou | AirLiquide Balazs |
| Hydroxylamine-free Chemistry for Sustainable Alternatives in Aluminum Post Etch Residue Removal Applications | Pei-Sung Hung | DuPont |
| Reduced Chemical Consumption and Metal Loss for Polymer Clean by Batch Spray | Bernhard Hammerl | Sicconex |
| Hsinfu Teng | Fudan University |