Post CMP Technical Program

Post CMP Cleaning Conference — Monday, March 27, 2017
8:00 am – 10:00 am: Registration and Networking

Session 1:Market Trends

10:00 AM: Introductions, Welcome, Conference Overview — Mark Thirsk
10:15 AM: KEYNOTE: Chemical/Mechanical Balance Management through Pad Microstructure in Si CMP — Hong Jin Kim, GlobalFoundries
11:30 AM: Post CMP Surface Preparation in sub 10nm Devices — JinGoo Park, Han Yang University

12:00 PM – 1:00 PM: LUNCH — Location: Tejas Restaurant

Session 2: Materials & Process Trends

1:00 PM: Challenges and Mechanistic Aspects for Advanced Post CMP Cleaners — Michael White, Entegris
1:30 PM: Enabling Low Defectivity Solutions Through Co-Development of CMP Slurries and Cleaning Solutions for Cobalt Interconnect Applications — Dnyanesh Tamboli, Versum Materials
2:00 PM: CMP Defects and Evolution of PCMP Cleans — Iqbal Ali, Linx Consulting
2:30 PM: CMP Stack Treck — Viorel Balan – CEA

3:00 PM – 3:30 PM: COFFEE — Location: Terrace

Session 3: Equipment & Process Trends

3:30 PM: High Shear Force Chemical Mechanic Cleaning for CMP Defect Reduction — Ekaterina Mikhaylichenko, Applied Materials
4:00 PM: Development of PCMP Cleaner for bothTungsten and Cobalt Applications — Cass Shang, DuPont EKC Technology
4:30 PM: CMP Technological Paradigm Shift To Surface Cleaning, Ratanak Yim – CEA

5:00 PM – 6:30 PM NETWORKING — Location: Courtyard Terrace

PostCMP Agenda

SPCC 2017 Sponsors
Levitronix logo Elemental Scientific logo
Asahi-Logo-sm KMG Chemicals logo

SPCC 2017 Media Partner is Global Water Intelligence

MAY 31 – JUNE 1, Hilton Portland & Executive Tower, Portland, OR