SPCC 2019 Technical Program
Individual Presentations are Listed Below
April 2, 2019
- R_PillarisettySemiconductor_Process_Challenges_for_Quantum_Computing – Ravi Pillarisetty
- Co_premetallization_clean_and_functional_water_rinse_in_BEOL _interconnect – Els Kesters
- Functional_water_solutions_to_enable_wet_cleaning_process – Hideaki Iino
- Controlled_Co_recess_for_advanced_interconnect_metallization– Antoine Pacco
- Development_of_Metal_Free_Wet_Etching_Chem_for_Ru_Interconnect – Takuya Ohashi
- Wet_etching_of_Ru_effect_of_thermal_annealing_ – Quoc Toan Le
- IL_Eng_to_Extend_Scalability_of_HK_Metal_Gate_for_Si_CMOS_Devices– Shariq Siddiqui
- Cleaning_Challenges__Scaling_Boosters_and_Performance_Enhancement_for_Adv_Logic_Devices – Yusuke Oniki
- Development_of_Selective_SiGe_Etchants– Glenn Westwood
- Thermal_ALE_of_Si_Using_an_Oxidation_and_Conversion-Etch_Mechanism – Steve George
- Si_trim_applications_benefits_and_challanges– Subhadeep Kal
- Phenomena_affecting_the_rate_and_equil_of_aqueous_chems_rxns_in_nanochannels – Guy Vereecke
- Improving_cleaning_for_adv_packaging – Christophe Lorant
- Effect_of_bubble_on_pc_agglomeration_in_W_CMP_slurry– Jin-Goo Park
- Optimization_of_the_removal_of_wafer_backside_ESC_defects_arising_from_ion_imp– Seiji Ano
Poster Presentations
- K_Harada-MGC-Improvement_in_post-CMP_cleaning_process_for_Ru_IC
- A Takanaka-Kanto-The_Effects_of_Reductant_on_the_Cleaning_Performance_for_Ceria_slurries
- S Liu-Entegris-Novel_method_to_characterize_the_retention_of_polydisperse_particles_by_advanced_membranes
- A_Klipp-BASF-TiN_Hardmask_Wet_Etching_and_Post_Etch_Residue_Removal_in_BEoL
- CK_Ge-Versum-Development_of_Wet-etch_Chemistries_for_Selective_Silicon_Nitride_Removal-in_3D_NAND_Structure.pptx
- W_Yeh-Dupont-Post-Etch_Residue_Removal_for_Cobalt_Contact-and_Interconnect
- Y_Tsuchisaka-Horiba-Development_of_Monitoring_Technique_for_High_Temperature-Phosphoric_Acid_by_Spectroscopy
- W-S_Tung-Dupont-TiN_High-K_Dielectric_Selective_Etching_for_Work_Function_Metal_removal_with_dielectric_compatibility
- B_Kang-BASF-Chemically_Controlled_Megasonic_Cleaning_Technology_for_Higher_PRE_and_Lower_Pattern_Damage
- D_Shin-SKKU-Study_on_Wet_Etching_of_Dummy_Poly-Si
- S_Hong-SKKU-Optimization_of_Water_Polishing_for_an_Improved_Abrasive_Removal
- H-T_Kim-HYU-Removal_of_Nano_Particles_on_the_Hard_Mask_Wafer_Backside_using_Brush_Cleaning
- X_Zou-Air_Liquide_Balazs-Surface_Analysis_for_EUV_Lithography_Process_Outgassing_Studies
- D_Bhattacharyya-GF-Elimination_of_Surface_Particles_with_Lobe_Signature_by_Optimizing-Post-Ash_Cleans
- W_Yeh-Dupont-Wet_Etchant_for_DRAM_Word_line_TiN_Recess_with_Selectivity_to_W
- S-C_Hu-NTUT-Humidity_Control_in_a_FOUP_by_LAC
- J_Kim-SKKU-Investigation_of_Ceria_Abrasive_Removal_during_Post_CMP_Cleaning
- C-Y_Chang-Versum-AlN_Removal_Formulation_with_Isotropic_Silicon_Etching_Property
- J-F_Lin-Dupont-Material_Solution_toward_Efficient_Polysilicon_post-CMP_Clean
- J-F_Lin-Dupont-Advances_of_Oxide_PCMP_Clean_Process
- J-F_Lin-Dupont-Approach_toward_enhanced_cerium_residue_control_on_post-CMP_cleaned_surface
- D_White-Entegris-Slurry_Particles_Defectivity_Improvements_and_Current_Challenges_for_Low_pH_W-Post_CMP_Cleaning_Formulations
April 3, 2019
- Design Technology Co-Optimization Approaches and Migrations to CFET and 3D Logic– Jeff Smith
- Oxide_Regrowth_Mechanism_during_SiN_Etching_in_Vertical 3D_NAND_Structure – Sangwoo Lim
- Phos_acid_rinse_impact_on_CMOS_devices – Philippe Garnier
- Hybrid_DHF_and_N2_Jet_Spray_Cleaning_for_SiN_and_Metal_Layer– Kook Hyun An
- Python_based_data_analysis_for_ToFS_IMS_data– Sean Stuart
- Optimization_of_Single_Nanoparticle_ICP-MS_Analysis_for_Controlling_Nanoparticles_in_Process_Chemicals– Lisa Mey-Ami
- Universal_surface_enhanced_Raman_spectroscopy– Ali Altun
- A_Slower_Global_Economy-But_Watching_Out_for_Recession– Duncan Meldrum
- Particle_adsorption_model_on_Si_wafer_for_clarifying_required_UPW_quality – Yoichi Tanaka
- Monitoring_and_Remediation_of_Contaminants_in_Bulk_Chemical– Eugene Shalyt
- New_Methods_To_Reduce_Variation_In-Bare_Wafer_Particle_Inspection_Results – Harvey Tang
- Contamination_Kinetics_Of_Airborne_NH3_On_Chromium-Coated_Wafer_In_Cleanroom_Conditionsx – Minh-Phuong Tran