The Business of Cleans 2019 Technical Program
April 1, 2019
- Economic Backdrop for Semiconductors – Duncan Meldrum
- Trends in Advanced Cleans Market – Mike Corbett
- From Waste to Reuse – Chemical Waste Management and Environmental Sustainability – Kathleen Fiehrer
- Current and Future Wet Etch Challenges – Nabil Mistkaw
- Cleaning Efficiency Improvement for FEOL CMP – Katrina Mikhaylichenko
- Filtration and Purification Impact to Cleans Contamination Control– Ted Caramberis
- Quality of Semiconductor Raw Materials – Evolution and Challenges – Yongqiang Lu
- Surface_Prep_and_cleans– Tianniu Rick Chen
- Asymptotically Approaching Zero Defects – The Future of Post-CMP Cleaning – Mike White
- Cleaning and Etching Solutions for Advanced Technology Nodes – Andreas Klipp
- MOL/BEOL Process and Integration Challenges and Solutions – Kevin Ryan